• Diamond Lap, Resin Bonded

Resin bond cutting lap. Similar to sintered laps but the diamond grit is embedded in a hard plastic-ceramic resin instead of metal. It offers several advantages over the sintered laps for example higher concentration, reduced SSD, improved temperature stability, lower cost and easy dressing with a pumice block.

Diamond layer is 6-7 mm thick and can be dressed many times. 6" laps has a 1/4" aluminum base and 8" a 1/2" base.

Diamond Lap, Resin Bonded

  • Product Code: HY-RESIN
  • Availability: 6
  • 1,750.00kr

  • Ex Tax: 1,400.00kr

Available Options

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Pumice stone for dressing sintered or resin bonded laps.Size 3x6x20 cm...

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